22 Слой высокопроизводительной печатной платы Megtron-6 | 2.0Толщина мм, отделка ENIG | Высокоскоростной & РФ решение – УГКПБ

In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (печатная плата) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.

1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Обзор продукта & Определение

This product is a 22-layer High-Density Interconnect (ИЧР) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, высокоскоростной, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.

2. Критические соображения дизайна

Designing such an advanced многослойная плата requires focus on:

1. Контроль импеданса: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.

2. Оптимизация стека: The intelligent arrangement of the 22 conductive layers (22Слои)—including signal, power, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.

3. Тепловое управление: The 2.0mm board thickness and multilayer structure aid heat distribution. Однако, strategic use of thermal vias remains essential for high-power IC areas.

4. High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.

3. Как это работает & Структура

А PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. Этот 22-СЛОВАЯ ПЕЧАТА ПЕЧАТА structure resembles a precise “multi-layer sandwich”:

• Внутренние слои: Use H/HOZ (примерно 1/1 oz or 35µm) copper for core power, основные плоскости, and some internal signal routing.

• Outer Layers: Использовать 1/1 oz copper for mounting primary components and routing critical signal traces.

• Dielectric Layers: All insulating prepreg materials are Panasonic Megtron-6 R-5775G, whose low Dielectric Constant (Дк) и коэффициент рассеяния (Дф) ensure superior high-speed signal transmission.

• Поверхностная отделка: Химическое никель, иммерсионное золото (СОГЛАШАТЬСЯ) в 2 micro-inches (2u”). This provides a flat, solderable surface, excellent oxidation resistance, and good wire-bonding capability, ideal for high-density BGA packages and RF connectors.

4. Основной материал: Panasonic Megtron-6 R-5775G

This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, высокоскоростной, low-loss circuit board material series.

• Key Performance: Features an extremely low Dielectric Constant (Dk~3.5) and ultra-low Dissipation Factor (Df~0.0015 @ 10GHz), significantly outperforming standard FR-4. Its high Glass Transition Temperature (Тг) ensures superior thermal stability and dimensional consistency during high-temperature reflow soldering processes.

• Application Fit: Optimized for high-speed digital signals (10Gbps+ to 56/112Gbps) and millimeter-wave RF applications.

Элемент		Метод испытаний	Состояние	Единица	МЕГТРОН6 Р-5775(Н) Стеклянная ткань с низким DK	МЕГТРОН6 Р-5775 Нормальная стеклянная ткань
Стеклянный переход температура.(Тг)		ДСК	А	°С	185	185
Термическое разложение темп.(Тд)		ТГА	А	°С	410	410
CTE x-ось	А1	ИПК-ТМ-650 2.4.24	А	ppm/° C.	14-16	14-16
Cte y-ось					14-16	14-16
КТР по оси Z	А1	ИПК-ТМ-650 2.4.24	А		45	45
	A2				260	260
T288(с медью)		ИПК-ТМ-650 2.4.24.1	А	мин	>120	>120
Диэлектрическая проницаемость(Дк)	12ГГц	Сбалансированный тип круговой диск резонатор	C-24/23/50	－	3.4	3.6
Коэффициент рассеяния(Дф)					0.004	0.004
Водопоглощение		ИПК-ТМ-650 2.6.2.1	D-24/23	%	0.14	0.14
Модуль изгиба	Наполнять	Jis c 6481	А	Средний балл	18	19
Прочность на очистку*	1унция(35мкм)	ИПК-ТМ-650 2.4.8	А	кн/м	0.8	0.8

5. Ключевые особенности & Производительность

1. Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.

2. Excellent Thermal & Стабильность размеров: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.

3. Возможность межсоединения высокой плотности: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (например, ПЛИС, GPUs).

4. Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the многослойная печатная плата.

5. Superior Solderability & Склеивание: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.

6. Scientific Classification & Основные приложения

• Scientific Classification:

  • По количеству слоев: High Multilayer PCB (Обычно >10 слои).

  • Материалом: Высокоскоростная печатная плата / Высокочастотная печатная плата / Low-Loss PCB.

  • По технологиям: HDI печатная плата (Subject to specific design features like blind/buried vias).

  • By Rigidity: Rigid PCB.

• Основные приложения & Варианты использования:

  • High-Speed Networking Equipment: Core backplanes and motherboards for 400G/800G optical modules, высококлассные маршрутизаторы, и переключатели.

  • Advanced Computing & Хранилище: AI server boards, Высокопроизводительные вычисления (HPC) clusters, enterprise SSD controller boards.

  • Аэрокосмическая промышленность & Радиолокационные системы: RF front-ends and signal processing units for avionics communication and phased array radar systems.

  • Расширенный тест & Измерительные приборы: Mainboards within high-speed oscilloscopes, spectrum analyzers, and signal generators.

7. Production Flow Overview

UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-Выравнивание слоя & Склеивание) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)

Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.

Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.

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