Communication high frequency hybrid PCB

Struktur und Zusammensetzung

Base Plate and Layers

The high-frequency hybrid PCB splint includes a base plate, welches gefaltet und auf der ersten inneren Drahtschicht positioniert wird, die erste äußere Drahtschicht, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.

High-Frequency and Auxiliary Areas

Das Substrat umfasst einen Hochfrequenzbereich und einen Hilfsbereich. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.

Design and Features

Division of Areas

Das Versorgungsmodell bietet eine hochfrequente Hybridschiene, die in zwei Teile unterteilt ist: ein Hochfrequenzbereich und ein Hilfsbereich. This design provides mechanical support.

High-Frequency Materials

The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.