6 Layer Rigid-Flex PCB Manufacturing | High-Reliability Adhesive-Free Design – UGPCB

UGPCB 6-Layer Adhesive-Free Rigid-Flex PCB 제품개요 & 정의

A 6-Layer Rigid-Flex PCB is an advanced 인쇄 회로 기판 technology that integrally combines rigid board stability with flexible circuit dynamic bending capability. This product from UGPCB utilizes a premium adhesive-free lamination 프로세스, resulting in a final board thickness of 1.50mm, dimensions of 120x80mm, and features an 동의하다 (무전해 니켈 침지 금, 3중”) 표면 마감. It represents a cutting-edge solution for 고밀도 상호 연결 (HDI) and three-dimensional electronic packaging, solving complex spatial and mechanical challenges in modern electronics.

Scientific Product Classification

According to IPC-6013D standards and product construction, this board is accurately classified as:

• By Construction: Rigid-Flex Printed Board (유형 4)

• 레이어 수에 의해: Six-Layer Board (combining rigid and flexible layers)

• 기술 별: Adhesive-less (Adhesive-Free) Flexible Material Rigid-Flex PCB

• 응용 프로그램에 의해: High-Reliability, High-Flex-Cycle Industrial & Medical Grade PCB

Core Structure & 재료

The exceptional performance is rooted in its sophisticated layered structure and top-tier materials:

• Core Flex Material: 특징 Shengyi’s 18/50/18 μm adhesive-free double-sided substrate. “18/50/18” denotes a structure of 1 온스 (18μm) 구리 / 50μm Polyimide (PI) dielectric / 1 온스 (18μm) 구리. 그만큼 adhesive-free construction bonds copper to PI chemically, eliminating adhesive layers, which significantly enhances thermal resistance, 화학 저항, 그리고 flex circuit 신뢰할 수 있음.

• Rigid Section Material: 용도 25/25 준비 for lamination in rigid areas, providing robust mechanical support.

• 표면 마감: The entire board employs 동의하다 (3중”). This 3-microinch gold layer offers excellent flatness, 내산화성, and solderability for PCB pads, making it ideal for assembling 미세 피치 부품 like BGAs.

Design Key Considerations & 작동 원리

Rigid-flex PCB design is critical for success. The board operates by routing electrical signals through flexible polyimide areas for dynamic movement, while using rigid FR-4 sections for component mounting and structural support.

Essential Design Guidelines Include:

1. Bend Area Definition: Clearly distinguish between static (one-time install) 그리고 dynamic (repeated operation) bend zones. Design the bend radius accordingly. A dynamic bend radius should be at least 10x the flex area thickness (for this board, ≥15mm is recommended).

2. Transition Zone Reinforcement: The rigid-to-flex junction is a stress point. 사용 teardrop pads, curved traces, 그리고 stiffeners to prevent delamination and cracking.

3. 임피던스 제어: For high-speed signals (예를 들어, differential pairs) crossing flex areas, precisely calculate trace width and dielectric thickness to maintain consistent 특성 임피던스 (예를 들어, 50Ω 단일 종단, 100Ω 차동).

4. Flex Routing Rules: In flexible areas, route conductors perpendicular to the bend axis. Use curved or staggered traces to distribute stress evenly.

성능 특성 & 장점

Compared to traditional adhesive-based rigid-flex PCBs or rigid-board+connector assemblies, this UGPCB product offers distinct PCB advantages:

• 향상된 신뢰성: The adhesive-free structure prevents delamination risks from adhesive aging or moisture absorption, increasing flex life by up to 10x and withstands over 100,000 동적 벤드 사이클.

• Superior Electrical Performance: Uniform PI dielectric with stable dielectric constant (Dk~3.4) ensures signal integrity for high-frequency applications and reduces loss.

• 가벼운 중량 & 고밀도: Eliminates connectors, 케이블, and solder joints, enabling 3D assembly. Can reduce system weight by up to 60% and save over 50% 공간.

• Excellent Durability: Resists extreme temperatures (-55°C ~ +125°C) and chemical exposure, 가혹한 환경에 적합합니다.

• Simplified Assembly: A single integrated component reduces assembly steps, potential failure points, and improves final product yield.

생산 공정 개요

UGPCB rigid-flex PCB manufacturing combines advanced rigid PCB fabrication 그리고 flexible circuit production 프로세스:

1. Inner Layer Fabrication: Separate etching of rigid FR-4 and flexible PI core layers.

2. 라미네이션: Precise alignment and high-temperature/pressure bonding of rigid layers, adhesive-free flex cores, and prepreg into a monolithic structure—a critical step in 다층 PCB 처리.

3. 교련 & 도금: Mechanical and laser drilling (if needed) followed by copper deposition and plating to create Plated Through Holes (PTH) for interlayer connection.

4. Outer Layer Imaging & 에칭: Pattern formation for outer layer circuits.

5. 표면 마감 적용: ENIG chemical deposition.

6. 표지 & Profiling: Application of protective film (coverlay) on flex areas. 정밀한 라우팅 그리고 레이저 절단 define the board outline and flex section openings.

7. Electrical Test & 최종검사: 100% 비행 프로브 or fixture testing for electrical continuity, followed by rigorous visual and dimensional inspection.

기본 응용 프로그램 & 사용 사례

이것 6-layer high-reliability PCB is the ideal choice for demanding applications:

• 항공우주 & 방어: Satellite deployment mechanisms, guidance systems, avionics sensors requiring utmost reliability and weight reduction.

• Advanced Medical Devices: 내시경, ultrasound probes, wearable monitors needing complex motion and signal transmission in minimal space.

• Industrial Robotics: Robot joints, internal robotic arm assemblies for seamless power/signal transmission across moving parts.

• Precision Instruments & 가전제품: Advanced camera modules, foldable display hinges, drone gimbals pursuing slimness and durability.

• 자동차 전자: Automated parking sensors, foldable dash displays, in-vehicle camera modules resistant to vibration and thermal cycling.

Ready to integrate superior reliability into your design? Contact UGPCB engineers today for a free design review and quote on your custom 6-Layer Rigid-Flex PCB solution.