1. Prezentare generală a produsului: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (Placă de circuit tipărită) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. The PCB măsuri 82.63 × 46.7 mm with a standard 1.6 mm grosimea plăcii. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 milioane de unități în 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. Definiția produsului și specificațiile tehnice
2.1 Parametrii de bază
| Parametru | Caietul de sarcini |
|---|---|
| Numele produsului | Placa mamă pentru hotă de bucătărie |
| Laminate Material | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| Grosimea plăcii | 1.6 mm |
| Numărul de straturi | 2 Straturi (Double‑Sided Board) |
| Dimensiune gata | 82.63 × 46.7 mm |
| Diametrul minim al găurii | 0.296 mm |
| Lățimea minimă a liniei / Spațiere între linii | 0.342 mm / 0.37 mm |
| Grosimea foliei de cupru | 1/1 Oz (35 μm per layer) |
| Finisaj de suprafață | Nichel neelectronic / Aur de imersiune (De acord / Gold Plating Process) |
| Masca de lipit / Legendă | Black Solder Mask / Legenda serigrafiei albe |
2.2 Laminate Material: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- Temperatura de tranziție a sticlei (TG) : 150° C. (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- Indicele comparativ de urmărire (CTI) : 600 V. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 V), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (Cte) : Alfa 1 la 41 PPM/° C., Alfa 2 la 235 PPM/° C..
- T288 Delamination Time : > 60 minute, several times higher than standard FR‑4 materials.
- Temperatura de descompunere termică (TD, 5% pierdere în greutate) : 370° C..
- Evaluarea inflamabilității : UL94 V‑0.
- Rezistivitatea suprafeței : 5.2 × 10⁸ MΩ.
- Rezistivitatea volumului : 6.1 × 10⁹ MΩ‑cm.
- Coajă de rezistență : 1.4 N/mm (pentru 1 oz folie de cupru).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, Standard generic pentru designul plăcii imprimate (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 mm. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
I = k × ΔT^0,44 × A^0,725
Unde:
- I = Maximum allowable current (Amperes, O)
- K = factor de corecție (0.048 for outer layer traces, 0.024 for inner layer traces)
- ΔT = Temperature rise (° C.)
- O = Conductor cross‑sectional area (mil²)
For this product with 1 oz folie de cupru (aproximativ 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. The 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 O), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 Principii de funcționare
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, etc.) travel via touch traces on the PCB to the MCU. După prelucrare, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, Lumini LED, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. Clasificarea produselor
Based on printed circuit board industry classification standards, acest produs se încadrează în următoarele categorii:
| Dimensiunea de clasificare | Categorie |
|---|---|
| După Structură | Rigid Printed Circuit Board |
| După numărul de straturi | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| După finisarea suprafeței | Nichel neelectronic / Aur de imersiune (De acord) |
| Prin cerere | Home Appliance Control Board (Cooker Hood Mother Board) |
| După evaluarea inflamabilității | UL94 V‑0 |
| Prin conformitatea mediului | Halogen‑Free, ROHS conform |
PeIPC‑6012F, Specificații de calificare și performanță pentru plăci imprimate rigide (released September 2023), this product meetsClasă 2 – Servicii dedicate Produse electronice cerințe. Clasă 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. Materiale folosite
5.1 Substrat: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- Armare : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (Tg 150°C)
- Folie de cupru : 1 oz Electrolytic Copper Foil (ED cupru)
- Sistem ignifug : Halogen‑free flame retardant (UL94 V‑0)
5.2 Finisaj de suprafață: Nichel neelectronic / Aur de imersiune (De acord)
This product uses the Electroless Nickel / Aur de imersiune (De acord) surface finish process. PeIPC‑4552B, Specificații pentru nichel electroless/aur de imersie (De acord) Placare pentru plăci imprimate (published May 2021), ENIG deposit thickness requirements are:
- Nickel Layer Thickness : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- Lipibilitate excelentă, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Superior oxidation and corrosion resistance
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 Mască de lipit și Legendă
- Masca de lipit : Black ink offering excellent insulation and heat resistance
- Legendă : White silkscreen providing high contrast for SMT placement and repair identification
6. Structura produsului și caracteristicile de performanță
6.1 Caracteristici structurale
Double‑Sided Design (2 Straturi) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Minimum hole diameter of 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : The 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
Standard 1.6 mm Grosimea plăcii : This thickness maintains mechanical strength while matching standard component lead lengths, facilitarea PCB asamblare.
6.2 Caracteristici de performanță
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (vârf 260°C).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (Caf) formare, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. Fluxul procesului de fabricație
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
Pas 1: Controlul de calitate primit (IQC) → Inspect KB6165G copper‑clad laminate, folie de cupru, film uscat, cerneală pentru mască de lipit, si alte materii prime
Pas 2: Tăiere → Cut large copper‑clad laminate sheets to working panel size
Pas 3: Foraj → Mașini de găurit CNC process the 0.296 mm minimum hole diameter along with other mounting holes and vias
Pas 4: Depunere de cupru electroless / Placare cu panouri → Metallize hole walls to create conductive through‑holes
Pas 5: Transfer de model → Apply dry film → Expose → Develop to form the circuit pattern
Pas 6: Gravură → Remove unprotected copper to create the designed circuit traces
Pas 7: Masca de lipit → Print black solder mask ink → Expose → Develop to expose pads
Pas 8: De acord (Nichel neelectronic / Aur de imersiune) → Electroless nickel plating (3‑6 μm) + Aur de imersiune (0.05‑0.10 μm)
Pas 9: Imprimare legenda → Print white silkscreen legend identifiers
Pas 10: Dirijare / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 mm
Pas 11: Testare electrică → Testarea sondei zburătoare / fixture testing to verify open/short circuit integrity
Pas 12: Controlul final al calității (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 Standarde
Pas 13: Ambalare și transport → Vacuum packaging + anti‑static bags, conform cu IPC packaging specifications
8. Application Scenarios and Market Applications
8.1 Scenarii de aplicare primare
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 Perspective de piață
China’s small appliance control board market is projected to reach approximately RMB 45 miliarde in 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% la 90% RH (significant steam generated during cooking)
- Gradul de poluare : Pollution Degree 2‑3 (fume and dust)
- Vibrație : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅Conformitatea cu standardele internaționale : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, fabricație, și inspecție
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, CTI 600 V, and UL94 V‑0 rating
✅Capacitate de producție de precizie : Minimum hole diameter of 0.296 mm și lățimea minimă a liniei de 0.342 mm
✅Finisaj de suprafață superior : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅Conformitatea mediului : Halogen‑free materials meeting RoHS and REACH directives
✅Customization Services : Flexible customization of dimensions, numărul de straturi, material laminat, și finisarea suprafeței
✅Livrare rapidă : Quick‑turn capability from prototypes to volume production
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UGPCB is committed to providing high‑quality cooker hood motherboard Fabricarea PCB-urilor services to customers worldwide. Indiferent dacă aveți nevoie de probe prototip sau producție în volum, we offer professional technical support and competitive pricing.
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📧 E-mail: sales@ugpcb.com
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💡 Please provide the following information for an accurate quote:
- PCB dimensions, numărul de straturi, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (prototip / lot mic / producție în volum)
- Dosare Gerber (dacă este disponibil)
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Declarația surselor de date
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : Specificații de calificare și performanță pentru plăci imprimate rigide, septembrie 2023, IPC International, Inc.
- IPC‑2221C : Standard generic pentru designul plăcii imprimate, august 18, 2025, IPC International, Inc.
- IPC‑4552B : Specificații pentru nichel electroless/aur de imersie (De acord) Placare pentru plăci imprimate, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : Kingboard Laminates Holdings Ltd. official product technical documentation
- UL94 : Standard pentru testele de inflamabilitate a materialelor plastice pentru piesele din dispozitive și aparate, Underwriters Laboratories Inc.
- IPC‑TM‑650 : Manualul metodelor de testare, IPC International, Inc.
