ЛОГОТИП УГКПБ
1. Обзор продукта
A double‑sided gold finger печатная плата (печатная плата) features gold‑plated contacts – commonly called “gold fingers” – arranged along the board edge. These contacts create a pluggable electrical path when inserted into a mating connector, such as a card slot or socket. All signals and power flow through these finger‑shaped terminals.
UGPCB’s double‑sided gold finger PCB uses an FR4 substrate with a 2‑layer design. The board thickness is 1.6 мм, and both inner and outer layers have 1 Оз меди. The minimum drilled via diameter is 0.3 мм, and the trace width and spacing are both 0.15 мм. The surface finish is immersion gold (СОГЛАШАТЬСЯ) over the entire board, with additional electroplated hard gold selectively applied to the gold finger areas. This product offers the routing flexibility of a double‑sided board together with the proven reliability of gold finger connections. It serves a wide range of electronic systems that require board‑to‑board plug‑in interfaces.
2. Product Classification and Positioning
According to IPC‑6012 (the rigid printed board qualification and performance specification), this product falls into the following categories:
| Классификация Измерение | Категория |
|---|---|
| По структуре | Double‑sided PCB – conductive traces on both sides |
| By Interconnection Method | With plated‑through holes (ПТХ) |
| By IPC‑6012 Performance Class | Сорт 2 (dedicated service electronic products) – suitable for most gold finger applications |
| By Substrate Material | FR4 rigid laminate (S1141 grade) |
| По отделке поверхности | СОГЛАШАТЬСЯ (electroless nickel / Погружение золота) + selective electroplated hard gold on gold fingers |
| By Function | Gold finger PCB / edge connector PCB |
This product is positioned as amedium‑to‑high‑reliability plug‑in connection решение. It combines the design freedom of double‑sided routing with the signal integrity of gold finger edge connectors.
3. Ключевые технические параметры
3.1 Субстрат: ФР4 + S1141 Laminate
FR4 is the most common rigid substrate in the PCB industry. It consists of glass‑fiber‑reinforced epoxy resin, which provides excellent mechanical strength, электрическая изоляция, and thermal resistance. This product uses S1141 FR4 laminate from Shengyi Technology, which complies with IPC‑4101/21.
Key performance indicators for S1141 (tested on 1.6 mm specimens) are listed below.
| Параметр | Типичное значение | Метод испытания |
|---|---|---|
| Температура стеклянного перехода (Тг) | 140°С (ДСК) | IPC‑TM‑650 2.4.25 |
| Температура термического разложения (Тд) | 310°С (5 % потеря веса) | IPC‑TM‑650 2.4.24.6 |
| Z‑axis CTE (before Tg) | 65 ppm/° C. | IPC‑TM‑650 2.4.24 |
| Z‑axis CTE (after Tg) | 300 ppm/° C. | IPC‑TM‑650 2.4.24 |
| Диэлектрическая проницаемость (Дк, 1 МГц) | 4.6 | IPC‑TM‑650 2.5.5.9 |
| Коэффициент рассеяния (Дф, 1 МГц) | 0.015 | IPC‑TM‑650 2.5.5.9 |
| Рейтинг воспламеняемости | UL 94 В‑0 | UL 94 |
| Водяной поглощение | 0.15 % | IPC‑TM‑650 2.6.2.1 |
Источник данных: Shengyi S1141 Technical Data Sheet, compliant with IPC‑4101/21.
UL 94 В‑0 is the highest flame‑retardant rating in the UL 94 vertical burn test. It requires that after two 10‑second flame applications, the total flaming combustion time for each specimen does not exceed 10 секунды, and no flaming drips ignite the cotton indicator. This ensures the PCB remains safe under abnormal heating or short‑circuit conditions.
3.2 Толщина доски: 1.6 мм
The 1.6 mm thickness is the industry standard for rigid PCBs. It also serves as the baseline thickness for S1141 material property data. This thickness achieves an optimal balance between mechanical strength, insertion stability, и стоимость изготовления. It is widely compatible with standard connector slots.
3.3 Толщина меди: 1 унция (Примерно 35 мкм)
Both inner and outer layer copper foils are1 унция (унция) , which is approximately 35 мкм толщиной. According to IPC‑6012, the minimum finished copper thickness for Class 1 и класс 2 boards is 48 мкм. Starting with 1 oz foil ensures that the final thickness after processing meets these requirements. This copper weight supports adequate current‑carrying capacity (approximately 4‑6 A, depending on trace width) while preserving fine‑line etching precision. The trace width and spacing of 0.15 мм (о 6 мил) are reliably producible with 1 Оз меди.
3.4 Minimum Via Diameter: 0.3 мм
The minimum mechanical drilled hole diameter is 0.3 мм, which is well within standard through‑hole technology capability. This supports plated‑through‑hole (ПТХ) processing to ensure reliable electrical interconnection between layers. Per IPC‑6012, all PTHs must pass thermal stress testing (288 °C solder dip) to verify structural integrity.
3.5 Ширина следа и расстояние: 0.15 мм / 0.15 мм
A trace width of 0.15 мм (примерно 6 мил) and a spacing of 0.15 mm represent a fine‑line capability within conventional PCB manufacturing. В 1 Оз. Толщина меди, а 0.15 mm trace can carry approximately 0.5‑0.8 A of current based on IPC‑2221 calculations. This meets the needs of most signal transmission and low‑power supply applications. This combination of width and spacing ensures reliability while keeping manufacturing costs under control.
4. Поверхностная отделка: Immersion Gold plus Electroplated Gold Fingers
This product uses acombined surface finish process: Погружение золота (СОГЛАШАТЬСЯ) across the entire board, сelectroplated hard gold selectively applied to the gold finger areas. This is the standard and optimal process for gold finger PCBs.
4.1 Погружение Золото (СОГЛАШАТЬСЯ) Процесс
Химический никель / Погружение Золото (СОГЛАШАТЬСЯ) is a finish where nickel is first chemically deposited onto the copper surface, followed by a thin gold layer deposited through a displacement reaction.
ПерIPC‑4552 Revision A (issued 2017) :
- Толщина никеля: 3 мкм до 6 мкм (120 μin to 240 μin)
- Толщина золота: 0.04 мкм до 0.10 мкм (1.6 μin to 4.0 μin)
- Recommended gold thickness: 0.04 мкм до 0.07 мкм (1.6 μin to 2.8 μin)
Источник данных: IPC‑4552 – Performance Specification for Electroless Nickel / Погружение Золото (СОГЛАШАТЬСЯ) Plating for Printed Boards.
Advantages of ENIG:
- Flat surface suitable for fine‑pitch traces and BGA packages
- Excellent solderability supporting lead‑free soldering (например, SAC305)
- Strong oxidation resistance with long shelf life
- Thin gold layer keeps costs manageable
4.2 Electroplated Gold Fingers – The Key Feature
The gold finger areas receiveadditional electroplated hard gold. Unlike the soft gold used in ENIG, electroplated hard gold contains hardeners such as cobalt or nickel (gold‑cobalt or gold‑nickel alloy). Its hardness can exceed HV 200, providing far greater wear resistance than soft gold.
Why must gold fingers use electroplated hard gold?
ENIG gold is extremely thin (only 0.04‑0.10 μm) and soft (hardness below HV 90). It wears away after just 3‑5 insertion cycles. Electroplated hard gold, with a thickness typically above 0.76 мкм, can withstand hundreds or even thousands of insertion cycles.
ПерIPC‑4556 (Hard Gold Performance Specification) :
| Application Class | Minimum Gold Thickness | Типичные приложения |
|---|---|---|
| Сорт 2 (Прочный) | ≥ 0.76 мкм (30 μin) | Most gold finger applications |
| Сорт 3 (Высокая надежность) | ≥ 1.27 мкм (50 μin) | High‑cycle insertion, промышленное / военный |
| Nickel Underlayer | 3-5 мкм | Required for all hard gold deposits |
Источник данных: IPC‑4556 – Performance Specification for Electroplated Hard Gold for Connectors and Gold Fingers.
The electroplated gold finger process used in this product complies with IPC‑4556 Class 2 through Class 3 стандарты, ensuring insertion life and contact reliability.
5. Соображения дизайна
5.1 Gold Finger Chamfering
The insertion end of the gold fingers must bechamfered to enable smooth entry into the connector slot.
- Chamfer angle: Typically 30° or 45°
- Chamfer depth: Для 1.6 мм толщина доски, the chamfer depth is typically 0.8‑1.0 mm, leaving a 0.6‑0.8 mm blunt edge at the tip
- Remaining tip thickness: Approximately one‑third to one‑half of the original board thickness
- Critical requirement: No solder mask may cover the chamfered area, and the gold layer must fully cover the chamfered bevel
5.2 Gold Finger Area Design Rules
- Gold fingers should be placed at the board edge in an orderly array
- Minimum spacing between adjacent gold fingers should be ≥ 7 мил (примерно 0.178 мм)
- The gold finger area must be clearly marked in the Gerber files with explicit plating instructions
5.3 Impedance Control Considerations
FR4 material has a dielectric constant Dk = 4.6 в 1 МГц. Для 50 Ω single‑ended or 100 Ω differential impedance control, designers can adjust trace width and dielectric thickness. The 0.15 mm trace width and spacing in this product meet most signal integrity requirements for standard designs.
6. Принцип работы
A double‑sided gold finger PCB operates through two core mechanisms: electrical contact ипередача сигнала.
- Electrical connection: The gold finger contacts at the board edge physically mate with the metal spring contacts inside the connector slot, establishing a low‑resistance electrical path.
- Signal transmission: The PCB traces route signals from various компоненты (чипсы, резисторы, конденсаторы, и т. д.) to the gold finger contacts, which then transmit through the connector to the motherboard or backplane. The double‑sided design allows routing on both the top and bottom layers, significantly increasing routing density and design flexibility.
- Pluggability: The electroplated hard gold layer on the gold fingers provides sufficient wear resistance to support multiple insertion cycles without degrading contact resistance or signal integrity.
7. Приложения и варианты использования
Double‑sided gold finger PCBs are widely used in electronic devices that requirepluggable connections. Общие приложения включают в себя:
| Application Area | Specific Products |
|---|---|
| Вычисление & Серверы | Memory modules (Ддр, DDR2, DDR3, DDR4, Др5), видеокарты, network interface cards, expansion cards |
| Бытовая электроника | USB drives, memory cards, card readers, смартфоны, умные часы |
| Communications Equipment | Маршрутизаторы, переключатели, communication modules |
| Промышленный контроль | Industrial control boards, data acquisition cards, test fixtures |
| Автомобильная электроника | In‑vehicle control units, информационно -развлекательные системы |
| Медицинские устройства | Medical electronic modules (with IPC‑6012EM medical supplement) |
| Аэрокосмическая промышленность | Avionics modules (with IPC‑6012FS aerospace supplement) |
FR4 double‑sided gold finger PCBs are particularly suitable formedium‑complexity, cost‑sensitive applications that demand plug‑in connectivity.
8. Схема производственного процесса
UGPCB follows a standard production sequence for double‑sided gold finger PCBs:
- Резка – Cut FR4 copper‑clad laminate to working panel dimensions.
- Бурение – Drill 0.3 mm through‑holes and mounting holes.
- ПТХ / Panel Plating – Apply electroless copper deposition in holes, then panel plate.
- Перенос узора – Expose and develop the circuit pattern.
- Pattern Plating – Electrolytically plate circuits and holes to 1 Оз меди.
- Офорт – Remove unprotected copper foil to form the final circuit traces.
- Припаяя маска – Apply green or other coloured solder mask ink.
- Surface Finish – ENIG – Apply electroless nickel and immersion gold over the entire board.
- Gold Finger Plating – Selectively electroplate hard gold on the gold finger areas.
- Gold Finger Chamfering – Chamfer the insertion end.
- Электрические испытания – Perform flying‑probe or fixture testing.
- Визуальный осмотр – Inspect per IPC‑A‑600.
- Packing & Shipping – Vacuum‑pack for moisture protection.
9. Performance and Quality Standards
This product is designed and manufactured in strict compliance with the following international standards:
| Стандартный | Заголовок | Scope |
|---|---|---|
| IPC‑6012 | Квалификационные и эксплуатационные характеристики жестких печатных плат | Overall performance and reliability |
| IPC‑A‑600 | Приемлемость печатных плат | Visual appearance and acceptance criteria |
| IPC‑4552 | ENIG Performance Specification | Immersion gold process control |
| IPC‑4556 | Electroplated Hard Gold Performance Specification | Gold finger hard gold process |
| IPC‑4101/21 | Specification for Rigid and Multilayer Printed Board Substrate Materials | FR4 material specifications |
| UL 94 В‑0 | Standard for Safety – Flammability of Plastic Materials | Flame‑retardant certification |
10. Почему выбирают UGPCB?
- Professional gold finger manufacturing experience – UGPCB has mature capabilities in electroplating and chamfering.
- End‑to‑end quality control – Every step from cutting to final inspection is managed per IPC standards.
- Traceable materials – Uses brand‑name FR4 laminates such as Shengyi S1141 with clear source traceability.
- Fast delivery – A dedicated double‑sided PCB production line supports rapid prototyping and volume production.
- Technical support – Provides DFM (Дизайн для производства) reviews and impedance control recommendations.
11. Inquire Now
UGPCB is committed to delivering high‑value double‑sided gold finger PCB solutions to customers worldwide. Нужен ли вамsample prototyping, small‑batch trial production, or high‑volume manufacturing, we have the expertise to serve you.
Contact us for a quote:
- Provide Gerber files or дизайн печатной платы данные
- Specify gold finger plating thickness (0.76 мкм до 1.27 μm recommended)
- Confirm chamfer angle (30° или 45°) and any other special requirements
Декларация источника данных
The technical data and standard references in this document are sourced from: IPC‑6012 Qualification and Performance Specification for Rigid Printed Boards; IPC‑4552 Performance Specification for Electroless Nickel / Погружение Золото (СОГЛАШАТЬСЯ) Plating for Printed Boards; IPC‑4556 Performance Specification for Electroplated Hard Gold for Connectors and Gold Fingers; IPC‑A‑600 Acceptability of Printed Boards; UL 94 Standard for Safety – Flammability of Plastic Materials; and the Shengyi S1141 Technical Data Sheet (compliant with IPC‑4101/21).
