ЛОГОТИП УГКПБ
Обзор продукта: What Is an OSP Antioxidant PCB Circuit Board?
АнOSP antioxidant PCB circuit board ИспользованиеОрганическая припаяя консерванты (ОСП) as its copper surface finish. This process deposits an ultra-thin organic film on bare copper surfaces. The film prevents oxidation during storage and assembly. During soldering, the flux quickly dissolves the OSP film. This exposes clean copper for reliable solder joints.
UGPCB’s OSP antioxidant PCB circuit board usesFR-4 glass epoxy laminate as the base material. It features 35μm (1 унция) медная фольга, 1.6мм толщина доски, and dimensions of 68.36 × 34.6mm. The minimum finished hole size is 0.45mm. Minimum trace width is 0.15mm and minimum spacing is 0.20mm. The product fully complies with IPC-6012E (rigid printed board qualification and performance) and IPC-4555 (high-temperature OSP performance) спецификации.
Этотdouble-sided OSP PCB serves consumer electronics, оборудование связи, and industrial controls. It works best where cost sensitivity and surface flatness matter most.
Классификация научной продукции
Based on international PCB classification systems, this product falls into these categories:
| Классификация Измерение | Категория |
|---|---|
| Материал подложки | FR-4 epoxy glass fabric rigid PCB |
| Количество слоев | Двусторонний (two-layer circuitry) |
| Поверхностная отделка | ОСП (Органическая припаяя консерванты) antioxidant |
| Рейтинг воспламеняемости | UL 94 В-0 |
| IPC Performance Class | Сорт 2 (dedicated service electronic products) |
| Медная толщина фольга | 1 унция (35мкм) standard copper |
| Толщина доски | 1.6mm standard rigid board |
| Hole Type | Through-hole compatible with SMT |
Key Technical Parameters Explained
Субстрат: FR-4 Epoxy Glass Fabric
FR-4 is the most common rigid substrate in the печатная плата промышленность. “фр.” means flame-retardant. “4” indicates epoxy resin combined with glass fabric that meetsUL 94 В-0 flammability standards. UL 94 В-0 requires vertical specimens to self-extinguish within10 секунды after two 10-second flame applications. No flaming drips may ignite cotton.
The glass transition temperature (Тг) measures heat resistance. Standard FR-4 Tg ranges from 130–140°C. Mid-Tg FR-4 reaches 150–160°C. High-Tg FR-4 exceeds 170°C. This product uses standard FR-4 with Tg ≥ 130°C (IPC-4101/21 compliant). This meets the thermal shock demands of reflow soldering (peak temperatures 240–260°C).
Медная толщина фольга: 35мкм (1 унция)
Copper thickness determines current-carrying capacity. This product uses35мкм медная фольга, known as1 Оз меди (1 oz/ft² ≈ 35μm). According to IPC-2221, 1 oz copper at 10°C temperature rise carries approximately:
- 0.15мм (6 мил) Ширина следа: 0.5–0.7A
- 0.20мм (8 мил) Ширина следа: 0.8–1.0A
The 35μm copper thickness is the most common standard for double-sided PCBs. It balances cost, current capacity, and manufacturing yield.
Размеры платы: 68.36 × 34.6mm
The finished board measures68.36mm × 34.6mm. This compact size suits tight electronic modules. Small PCBs demand tighter precision—dimensional tolerances typically stay within ±0.15mm (IPC-6012 Класс 2).
Minimum Finished Hole Size: 0.45мм
0.45мм is the minimum plated through-hole (ПТХ) diameter. This hole size is a standard in the industry. It ensures reliable plating (aspect ratio approximately 3.6:1 with 1.6mm board thickness). The hole size accommodates most DIP components and standard SMT pad designs.
PCB Thickness: 1.6мм
1.6мм is the most common board thickness in PCB manufacturing. It provides excellent mechanical strength and flexural rigidity. It matches standard connectors and sockets perfectly.
Ширина следа и расстояние: 0.15мм / 0.20мм
This product offersminimum trace width of 0.15mm (о 6 мил) иminimum spacing of 0.20mm (о 8 мил). According to IPC classification, these dimensions fall intoСорт 2 (dedicated service electronic products). This precision meets most medium-density PCB designs, including MCU control boards, power management modules, and interface converter boards.
How OSP Antioxidant Process Works
The OSP process grows an ultra-thin organic film on clean bare copper throughchemical adsorption. The OSP film mainly consists ofalkyl benzimidazole compounds (azole-based). Film thickness typically ranges from0.2–0.5μm.
Protection Mechanism
The OSP film protects copper surfaces through three mechanisms:
- Physical barrier – The organic film forms a dense molecular layer. It blocks oxygen and moisture from contacting the copper surface.
- Chemical adsorption – Active groups in OSP molecules bond chemically with copper atoms. This creates strong adhesion.
- Selective protection – The OSP film covers only copper areas. It does not affect solder mask or other non-metallic regions.
Behavior During Soldering
During SMT reflow, temperatures reach190–230°C. The flux’s active ingredients decompose and dissolve the OSP film. This exposes clean copper underneath. Solder directly contacts bare copper and formsintermetallic compounds (IMC). This creates reliable electrical connections. The OSP filmcompletely decomposes with no residue after soldering.
Ключевые характеристики производительности
Based on IPC-TM-650 test methods:
| Характеристика | Типичное значение / Requirement | Reference Standard |
|---|---|---|
| OSP Film Thickness | 0.2–0.5μm | IPC-4555 |
| Solder Wetting Angle | ≤30° (после 1 переиз) | ИПК-ТМ-650 2.4.1 |
| Solder Spread Ratio | ≥80% | ИПК-ТМ-650 2.4.1 |
| Oxidation Protection (ambient) | ≥6 months | IPC-4555 |
| Contact Resistance Change | ≤10% (после 6 months storage) | ИПК-ТМ-650 |
OSP Antioxidant PCB Manufacturing Process
OSP antioxidant PCB manufacturing follows strict process controls. Every step affects final quality and reliability.
Front-End Processes (Substrate Preparation & Паттерн схемы)
- Материальная резка – Cut FR-4 copper-clad laminate to size
- Бурение – CNC drilling with 0.45mm minimum hole size
- Electroless Copper / Гальваника – Metallize hole walls for layer-to-layer connection
- Circuit Pattern Transfer – Dry film / wet film exposure and development
- Офорт – Remove unwanted copper to create 0.15mm trace / 0.20mm spacing circuitry
- Solder Mask Printing – Apply green or other colored solder mask ink
- Pre-Clean – Remove oxides and contaminants before surface finish
OSP Coating Process (Core Process)
The typical OSP coating flow:
Degreasing → Double Water Rinse → Micro-Etching → Double Water Rinse → Acid Pickling → DI Water Rinse → OSP Film Formation → Air Drying → DI Water Rinse → Final Drying
- Micro-Etching – Removes copper oxides and creates a uniform microscopically rough surface. This promotes OSP film growth.
- OSP Film Formation – Immerse the PCB in OSP chemistry (alkyl benzimidazole, organic acids, copper chloride, and deionized water). The film grows through chemical adsorption on copper surfaces.
- Film Thickness Control – Precise control is critical. Too thin means poor heat resistance. Too thick hinders flux action and solder flow.
Back-End Processes
- Маршрутизация – CNC routing to final dimensions
- Электрические испытания – Flying probe or fixture testing
- Заключительная проверка – Visual inspection and film thickness sampling
- Vacuum Packaging – Moisture-proof and oxidation-proof packaging
Product Features and Core Advantages
Отличная плоскостность поверхности
The OSP film is only0.2–0.5μm thick. It forms through chemical adsorption with uniform thickness and a smooth surface. This preserves the original copper foil flatness. It is ideal forfine-pitch SMT компоненты (such as 0.4mm and below pitch QFP, QFN packages).
Превосходная паяемость
The OSP film dissolves quickly in flux during reflow. This exposes fresh copper for reliable IMC formation. The OSP process supports bothсквозное отверстие (ТТТ) иsurface-mount (СМТ) пайрь.
Cost-Effective
OSP uses no precious metals (золото, silver, palladium). Material and processing costs are lower than ENIG, погружение серебро, or immersion tin. For high-volume production like consumer electronics, OSP offers exceptional cost competitiveness.
Environmentally Compliant
OSP uses organic compounds. It contains no lead, mercury, cadmium, or hexavalent chromium. It fully meetsRohs 2.0 требования. Waste treatment costs and complexity are also lower than metal finishing processes.
Short Processing Time
OSP coating is simple and fast. It needs no complex plating equipment or long deposition times. Compared to ENIG (which takes hours), OSP completes surface finishing in30–60 minutes за партию. This significantly reduces lead times.
Design Guidelines and Important Considerations
Дизайн для производства (DFM) Rules
Based on this product’s process capabilities:
| Design Parameter | Product Capability | Recommended Design Value |
|---|---|---|
| Минимальная ширина трассировки | 0.15мм | ≥0.15mm (следы сигнала) |
| Minimum Spacing | 0.20мм | ≥0.20mm |
| Минимальный размер отверстия | 0.45мм | ≥0.45mm |
| Толщина доски | 1.6мм | 1.6мм (стандартный) |
OSP Process Limitations and Mitigations
OSP offers many benefits but has inherent limitations:
- Limited Shelf Life – OSP film protects for6 месяцы in ambient conditions. For best solderability, complete SMT assembly within 3 месяцы.
- Moisture Sensitivity – OSP films degrade in high-temperature, high-humidity environments. Store boards at20–25°C with 40–60% relative humidity.
- Limited Reflow Cycles – Standard OSP withstands1–2 reflow thermal shocks. Multiple reflows require high-temperature OSP (IPC-4555 compliant).
- Electrical Test Challenges – The OSP film is insulating. It affects electrical test contact reliability. Test points need solder paste printing to remove the OSP layer.
Storage and Handling Recommendations
- Vacuum-sealed packaging with desiccant and humidity indicator cards
- Среда хранения: temperature ≤30°C, relative humidity ≤60%
- Complete soldering within48 часы of opening the package
- Wear anti-static gloves during handling. Avoid bare hand contact with board surfaces.
Типичные сценарии применения
OSP antioxidant PCB circuit boards serve many industries due to theircost advantage, surface flatness, and excellent solderability:
Бытовая электроника
- Smartphone motherboards and tablet PCBs
- Computer motherboards and graphics cards
- Home appliance control boards
- Wearable device circuit boards
Коммуникационное оборудование
- Router and switch PCBs
- Communication modules and IoT devices
- Bluetooth / Wi-Fi module carrier boards
Промышленный контроль
- PLC programmable logic controllers
- Power management modules
- Instrumentation circuit boards
- Motor drive control boards
Автомобильная электроника (Non-Safety-Critical)
- In-vehicle infotainment systems
- Модули управления кузовом
- Sensor interface boards
Quality Assurance and Standards Compliance
Applicable Standards
UGPCB’s OSP antioxidant PCB product strictly follows these international standards:
| Стандартный | Заголовок | Scope |
|---|---|---|
| IPC-4555 | Performance Specification for High Temperature Organic Solderability Preservatives (ОСП) for Printed Boards | OSP process requirements and testing |
| IPC-6012E | Квалификационные и эксплуатационные характеристики жестких печатных плат | Finished board quality and performance |
| МПК-4101/21 | Specification for Glass-Reinforced Epoxy Laminate | FR-4 substrate technical requirements |
| ИПК-ТМ-650 | Руководство по методам испытаний | Various performance test methods |
| UL 94 В-0 | Flammability of Plastic Materials | Substrate flame retardant safety |
| Rohs 2.0 | Restriction of Hazardous Substances | Environmental compliance |
Key Quality Indicators
Per IPC requirements, key quality metrics include:
- OSP Film Thickness: 0.2–0.5μm, uniformity tolerance ≤ ±0.1μm
- Adhesion: ≥4B (ИПК-ТМ-650 2.4.29 cross-cut test)
- Solder Spread Ratio: ≥80% (ИПК-ТМ-650 2.4.1)
- Oxidation Protection Period: ≥6 months (ambient conditions)
- Рейтинг воспламеняемости: UL 94 В-0
Why Choose UGPCB for OSP Antioxidant PCBs?
Возможности точного производства
- 0.15mm minimum trace width / 0.20mm minimum spacing
- 0.45mm minimum finished hole size
- 1.6mm standard board thickness with excellent compatibility
Reliable OSP Process Control
- Strict adherence to IPC-4555 for film thickness and quality
- Full traceability throughout the manufacturing process
- Solderability testing and film thickness sampling for every batch
Быстрая доставка
- Standard lead time: 7–10 working days
- Supports both prototype sampling and volume production
Comprehensive Technical Support
- Free DFM design review
- Professional engineering team for product selection guidance
Получите предложение сегодня
UGPCB delivers high-value OSP antioxidant PCB circuit board solutions. Нужен ли вамprototype sampling илиvolume production, we provide professional technical support and competitive pricing.
📞 How to Get a Quote:
- Submit your Gerber files and BOM list
- Our engineering team responds with a customized solution and quote within24 часы
- Free DFM check to ensure your design passes the first time
Data Source Statement: The technical data and standard requirements cited in this document are primarily derived from IPC (Ассоциация, объединяющая электронную промышленность) standards including IPC-4555 “Performance Specification for High Temperature Organic Solderability Preservatives (ОСП) for Printed Boards,” IPC-6012E “Квалификационные и эксплуатационные характеристики жестких печатных плат,” МПК-4101/21 “Specification for Glass-Reinforced Epoxy Laminate,” ИПК-ТМ-650 “Руководство по методам испытаний,” and UL 94 “Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances.” Some process parameters reference publicly available technical data from leading PCB manufacturers. All data has been verified for accuracy.
