Ultradünne 0,30 mm Hochfrequenz-Leiterplatte | 2-Layer Rogers R04003 Board mit ENIG | UGPCB

Ultra-Thin High-Frequency PCB: 0.30mm Thick 2-Layer Rogers R04003 Produktübersicht & Definition

Das Ultra-Thin High-Frequency PCB aus UGPCB is a double-sided printed circuit board manufactured using Rogers R04003 Hochfrequenzlaminat. Engineered for electronic devices with stringent demands on size, Gewicht, and RF performance, this board excels in radio frequency (Rf), microwave communication, and high-speed digital applications. Its core advantage lies in the combination of an extremely thin profile (0.30mm) Und superior dielectric properties, making it a critical component for device miniaturization and enhanced performance.

Technische Spezifikationen & Einstufung

• Einstufung: High-Frequency/Microwave Leiterplatte, Ultra-Thin PCB

• Schichten: 2 Schichten (Doppelseitige Leiterplatte)

• Brettdicke: 0.30 mm

• Grundmaterial: Rogers R04003 Laminate (0.2mm core, built up to final thickness)

• Kupfergewicht (Finished): 1oz / 1oz (ca. 35μm per side)

• Oberflächenbeschaffung: Elektrololes Nickel -Eintauchgold (ZUSTIMMEN), 2M”

• Abmessungen: 124.45 mm x 39.69 mm

Materialien & Leistungseigenschaften

• Laminieren: Rogers Ro4003c laminate is used, featuring a stable dielectric constant (Dk ~3.0) and a very low dissipation factor (Df). This is essential for Hochfrequenzschaltungsbretter to minimize signal loss and ensure signal integrity.

• Kupferfolie: Standard 1oz (35μm) electro-deposited copper, offering excellent conductivity and current-carrying capacity.

• Oberflächenbeschaffung: ZUSTIMMEN (2M”) bietet eine Wohnung, lötbar, and oxidation-resistant surface. The thin gold layer is particularly suitable for RF and microwave PCBs, minimizing signal attenuation due to the skin effect at high frequencies.

Struktur, Design & Manufacturing Key Points

1. Struktur: Standard 2-layer board structure with plated through-holes (PTH) Für die Konnektivität zwischen den Schichten.

2. Überlegungen zum kritischen Design:

   • Impedanzkontrolle: Präzise Leiterplatte mit kontrollierter Impedanz design is crucial. Trace width/spacing must be carefully calculated based on the Dk of RO4003 and the 0.30mm dielectric thickness to achieve target impedance values (z.B., 50Oh).

   • Thermalmanagement: The thin profile offers a short path for heat dissipation. Layout of high-power components must be planned accordingly.

   • Mechanical Handling: The 0.30mm thickness offers flexibility but requires careful handling and support during assembly to prevent bending or damage.

3. Production Process Flow:
   Material Preparation → Inner Layer Imaging → Lamination (RO4003 core with prepreg) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging & Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Profiling to 124.45x39.69mm → Electrical Testing (Flying Probe) → Final Inspection & Packaging

Wie es funktioniert & Schlüsselmerkmale

A Hochfrequenz-Leiterplatte acts as a “Autobahn” for signal transmission, ensuring minimal loss, Verzerrung, and delay. Der Rogers RO4003 material Und precision impedance-controlled design are fundamental to this performance.

Wichtige Produktmerkmale:

• Excellent High-Frequency Performance: The low-loss characteristics of RO4003 laminate enhance RF circuit efficiency and Signalintegrität.

• Extremely Thin and Lightweight: The 0.30mm thin core PCB profile saves critical space and aids in product lightweighting.

• Hohe Zuverlässigkeit & Lötbarkeit: The ENIG finish ensures long-term shelf life, excellent solder joint reliability, and a flat surface for fine-pitch components.

• Präzisionsfertigung: Fabricated to exact dimensions (124.45×39.69mm) for reliable integration into compact assemblies.

Primäranwendungen & Anwendungsfälle

Das ultra-thin Rogers PCB ist ideal für:

• RFID Modules: Antenna and Leiterplatten in compact readers.

• Satellite Communication & GPS Devices: Miniaturized receiver modules.

• Automotive Radar Sensors: Antenna boards for 77GHz radar systems.

• High-End Test & Messgeräte: Probes and signal acquisition boards.

• Portable Communication Devices & Uavs: RF front-end modules where size and weight are critical.

Why Choose UGPCB for Your Ultra-Thin High-Frequency PCB?

Succeeding in competitive RF and high-speed markets requires a PCB partner with deep expertise. UGPCB provides a complete solution, aus Hochfrequenz PCB-Design Unterstützung Zu high-reliability manufacturing compliant with IPC standards. Every 0.30mm thin PCB we produce undergoes rigorous impedance testing and quality checks, guaranteeing performance in real-world applications.

For your microwave antenna board oder high-speed transmission module, trust UGPCB to deliver superior Signalintegrität and power efficiency. Wir sind spezialisiert auf RF circuit board fabrication Und microwave PCB manufacturing.

Contact us today for a quote on your high-frequency PCB project.