12-Layer High-Speed High-Reliability PCB | 2.4mm d'épaisseur | Nanya NY6300S | Back Drilling & RTF Foil

Professional Product Overview: The 12-Layer High-Speed, High-Density PCB

In the era of high-speed data transmission and complex system integration, conventional printed circuit boards (PCB) fall short of meeting the performance demands of advanced electronics. Le 12-layer high-speed, PCB haute densité is the engineered solution. Featuring up to 12 precisely aligned conductive layers, it enables intricate interconnections and efficient signal transmission within a compact footprint, serving as the “central nervous system” for high-end networking gear, data center servers, calcul haute performance (HPC), and AI hardware.

As an expert Fabricant de PCB et PCB supplier, UGPCB leverages advanced processes to deliver reliable 12-couche Carte PCB production, ensuring your products maintain a competitive performance edge.

In-Depth Parameter Analysis: The Foundation of Performance

The capability of a high-quality multilayer printed circuit board is defined by its specifications. Below is an analysis of this product’s core parameters:

• Nombre de couches & Stack-up: 12 couches. Ce multilayer PCB design offers superior signal integrity (ET), intégrité de puissance (PI), and EMC performance compared to boards with fewer layers. It allows for dedicated power and ground planes, providing clear return paths for high-speed signals.

• Épaisseur du panneau & Tolérance: 2.4mm ±10%. This robust thickness offers excellent mechanical strength for backplanes and large-form-factor applications, ensuring reliability during mating and installation. The tight tolerance guarantees consistency in assembly.

• Finished Copper Weight: Unique distribution: 1/1/1/1/1/2/2/1/1/1/1/1 oz. This indicates that the inner layers (L6 & L7) utilize 2oz heavy copper, designed specifically for high-current power delivery. The outer and other signal layers use 1oz copper, optimized for fine-line etching. This hybrid construction is a hallmark of haute fiabilité Fabrication de circuits imprimés.

• Critical Process Capabilities:

  • Minimum Drilled Hole Size: 0.2mm. Supports high-density BGA fan-out, enhancing routing flexibility.

  • Minimum Line Width/Space: 0.076mm / 0.09mm (3mil / 3.5mil). Réaliser Interconnexion à haute densité (IDH)-level routing, essential for high-speed signal propagation.

• Finition de surface: OSP (Conservateur de soudabilité organique). Compatible with both leaded and lead-free soldering, it protects copper pads from oxidation, offers excellent surface planarity, and is cost-effective—ideal for boards with dense SMT composants.

Core Materials & Key Technologies: Enabling Superior Signal Integrity

1. High-Performance Laminate: Utilizes Nanya NY6300S high-speed laminate. Its high glass transition temperature (Tg >150° C) ensures dimensional stability and reliability during high-temperature reflow soldering. Its optimized dielectric constant (Ne sait pas) and dissipation factor (Df) significantly reduce signal loss at high frequencies, forming the material foundation for PCB haute fréquence.

2. Advanced Copper Foil: Employs RTF (Reverse Treated Foil) cuivre. Compared to standard electrodeposited (Élégant) foil, RTF foil features a smoother, low-profile surface on the treated side. This reduces signal loss due to the “effet peau” at high frequencies, critically enhancing the performance of differential signals exceeding 10 Gbit/s.

3. Critical Process: Controlled-Depth Drilling (Back Drilling): In 12-layer or higher multilayer PCBs, the unused portion (stub) of a through-hole via can cause significant signal reflection, degrading integrity. Le back drilling process precisely removes this non-functional via stub, eliminating its negative impact—a key technology for high-speed multilayer PCB performance.

Flux de production & Assurance qualité

UGPCB 12-processus de fabrication de PCB en couches strictly adheres to Normes IPC and includes Conception de la fabrication (DFM) revoir, inner layer imaging, laminage, forage (including back drilling), placage, outer layer imaging, solder mask application, finition de surface (OSP), routage, electrical testing, et inspection finale. Each stage is supported by precision measurement equipment (Zone d'intérêt, Impedance Testing, Flying Probe Test), ensuring every circuit imprimé delivered meets design specifications and our high-quality standards.

Applications typiques & Product Classification

This high-performance Carte PCB is designed for demanding electrical environments and complex systems, primarily used in:

• High-End Network & Équipement de communication: Core motherboards for 400G/800G optical modules, high-end routers, and switches.

• Data Center & Cloud computing: Server motherboards, accelerator cards, storage backplanes.

• Informatique haute performance: Workstation motherboards, GPU computing cards, AI accelerator hardware.

• Advanced Test & Measurement Instruments: Internal boards for instruments processing very high-frequency signals.

Scientific Product Classification:

• Par nombre de couches: PCB multicouche (>8 couches)

• By Technology Type: High-Speed/High-Frequency PCB, PCB HDI, PCB en cuivre lourd (partial)

• Par candidature: Telecom Infrastructure PCB, Data Center/Server PCB

Why Choose UGPCB for Your 12-Layer High-Speed PCB?

• Expertise technique: Proven mastery of back drilling et RTF copper foil application to tackle high-speed design challenges.

• Precision Manufacturing: Capable of 3/3.5 mil line/space, meeting stringent high-density interconnect requirements.

• Material Integrity: Core use of reputable high-speed laminates like Nanya NY6300S ensures foundational performance.

• Support de conception: Expert Conception de circuits imprimés et DFM review services to de-risk your project from the start.

• Consistent Quality: A fully controlled Production de PCB and inspection system delivers reliable products you can trust.

Ready to elevate your hardware? Contact UGPCB’s engineers for a free PCB quote et Analyse DFM on your next 12-layer high-speed board project.