Conception de circuits imprimés, Fabrication de PCB, PCB, PECVD, et sélection des composants avec un service à guichet unique

Télécharger | À propos | Contact | Plan du site

2-Couche PCB rigide 1,6 mm | FR-4 TG150 HASL sans plomb | Fabrication UGPBC - UGPCB

Carte PCB standard/

2-Couche PCB rigide 1,6 mm | FR-4 TG150 HASL sans plomb | Fabrication UGPBC

Nombre de couches: 2 Couches PCB rigide

Épaisseur du panneau: 1.60mm

Matériel: FR-4TG150

Finition de surface: Lead-Free Hot Air Solder Leveling (HASL), White Solder Mask, Black Legend

  • Détails du produit

UGPCB Standard 2-Layer Rigid PCB: Reliable 1.6mm FR-4 Circuit Boards for Demanding Applications

At the heart of modern electronics, le Circuit imprimé (PCB) acts as the foundational platform, interconnecting components and routing signals with precision. UGPCB Standard 2-Layer Rigid PCB, built with a robust 1.60mm épaisseur and high-performance FR-4 TG150 material, represents the optimal balance of durability, performance électrique, and cost-effectiveness for a wide range of applications. Ce double sided PCB is a proven solution for prototypes and medium-complexity electronic devices.

UGPCB Standard 2-Layer Rigid PCB

Définition du produit & Classification

Technical Classification:

  • Par nombre de couches: Double-Sided PCB / Two Layer PCB

  • By Substrate Rigidity: PCB rigide

  • Par matériau de base: Glass Epoxy (FR-4) PCB

  • By Flammability Rating: UL94 V-0 (inherent to FR-4)

  • By Assembly Compatibility: Technologie à travers (Tht) and Surface-Mount Technology (CMS) capable PCB.

This product is a double sided circuit board constructed with copper clad laminate on both sides of an insulating FR-4 core. Electrical connection between layers is achieved via plated through-holes (PTH). Le 1.60mm (environ 1/16 pouce) board thickness is an industry-standard, offering excellent mechanical stability.

Construction & Spécifications de matériau

Layer Stack-Up:

Ce 2 layer rigid PCB structure is as follows (top to bottom):

  1. Top Solder Mask (Blanc): Insulating layer to prevent solder bridges.

  2. Top Copper Layer (1 once, ~35µm): Etched to form conductive traces and pads.

  3. Insulating Core Substrate (FR-4, Tg150): Provides mechanical support and electrical insulation.

  4. Bottom Copper Layer (1 once, ~35µm): Etched to form bottom-layer circuitry.

  5. Bottom Solder Mask (Blanc): Insulating protective layer.

  6. Silkscreen Legend (Noir): Component designators, logos, and markings.

Key Materials:

  • Base Laminate: FR-4TG150. This denotes a flame-retardant glass-reinforced epoxy laminate with a Glass Transition Temperature (Tg) of 150°C. It offers superior mechanical strength, isolation électrique, and thermal reliability for a rigid printed circuit board, making it the industry’s most cost-effective choice.

  • Feuille de cuivre: Standard 1-ounce (once) Electro-Deposited copper for optimal conductivity and current carrying capacity.

  • Finition de surface: Lead-Free Hot Air Solder Leveling (HASL). A cost-effective and reliable PCB surface finish that provides excellent solderability, good shelf life, and robust protection against oxidation.

  • Inks: High-quality photo-imageable white solder mask ink and durable black epoxy silkscreen ink.

(Image Suggestion: Cross-sectional diagram of the PCB stack-up)
Alt Tag: Detailed cross-sectional diagram of a 2 layer rigid PCB showing copper, FR-4 core, and solder mask layers.

Directives de conception & Operational Principle

Critical Design Considerations:

  1. Via la conception: Maximize the routing space of your double sided Conception de circuits imprimés by strategically placing Plated Through-Holes (PTHs) for inter-layer connections.

  2. Largeur de trace / espacement: For 1oz copper, a standard minimum trace/space is 6mil/6mil (~0.15mm) to ensure reliable manufacturability and current capacity.

  3. Tampon & Hole Annular Ring: Ensure adequate pad size relative to the drill hole to guarantee a strong connection for Assemblage de circuits imprimés et fiabilité.

  4. Masque de soudure & Écran à soigneux: White solder mask aids visual inspection during Assemblage SMT, while clear black silkscreen is crucial for Prototypage PCB and repair.

Operational Principle:

A PCB does not generate function but enables it through its predefined conductive pathways. The etched copper traces replace discrete wiring, providing electrical connections between components. The insulating FR-4 substrate prevents short circuits. Plaqué à travers les trous (PTHs) serve as vertical conduits, connecting the top and bottom PCB copper layers, thereby doubling the available routing area compared to a single-sided board and increasing design flexibility.

Caractéristiques de performance & Avantages

  • Haute fiabilité: Le FR-4 TG150 substrate ensures stable performance in environments below its Tg, offering excellent thermal and mechanical stability for a rigid circuit board.

  • Excellent Electrical Properties: Low dielectric constant and dissipation factor support the signal integrity requirements of most digital and analog circuits.

  • High Manufacturability: Le 1.6mm PCB standard épaisseur et HASL sans plomb process are mature, ensuring high yield, contrôle des coûts, and fast lead times.

  • Superior Solderability: The HASL finish offers a flat, wettable surface ideal for both through-hole soldering et SMT soldering processes.

  • Clear Identification: High-contrast white solder mask with black legend facilitates efficient PCB inspection, essai, and rework.

  • Environmental Compliance: Lead-Free HASL finish complies with RoHS and other environmental directives.

Standard Manufacturing Process Flow

UGPCB adheres to IPC standards throughout our PCB fabrication process:
Panelization → Drilling → Electroless Copper Deposition → Dry Film Lamination & Imaging → Copper Plating → Etching → Solder Mask Application & Curing → Silkscreen Printing → Surface Finish (HASL sans plomb) → Profiling/Routing → Electrical Testing (Sonde volante) → Final Automated Optical Inspection (Zone d'intérêt) → Packaging & Shipment.

Applications principales & Cas d'utilisation

This versatile two layer rigid PCB is widely used in industries that demand a balance of reliability and value:

  • Commandes industrielles: PLC interfaces, sensor modules, entraînements à moteur, HMI controller boards.

  • Electronique grand public: Smart appliance controllers, amplificateurs audio, alimentations, educational kits.

  • Télécommunications: Router/switch peripheral boards, RF antenna modules, network monitoring units.

  • Électronique automobile: Systèmes d'infodivertissement, lighting control modules, body control modules (non-safety critical).

  • Électronique de puissance: Smart meter PCBs, UPS control boards, solar inverter circuitry.

  • Test & Measurement: Data acquisition cards, instrument control panels, handheld tester boards.

 

Double-Layer FR-4 PCB Applications in Industrial Control

Why Choose UGPCB for Your 2-Layer PCB Needs?

Choosing UGPCB means partnering with a reliable Fabricant de PCB committed to quality. We specialize in Prototype de PCB and medium-volume production, implementing rigorous Electrical Testing and IPC-A-600 based inspection on every board. From simple 2 panneaux de couches to complex multi-layer designs, Nous fournissons un expert PCB design for manufacturing (DFM) support and a streamlined supply chain.

Contact us today for a competitive quote and swift lead time on your 1.6mm FR-4 2-Layer PCB project!

(Image Suggestion: Gallery of finished PCBs with different designs)
Alt Tag: Gallery of various 2 layer rigid PCB examples manufactured by UGPCB with white solder mask.

Précédent:

Suivant:

Laisser une réponse

Laisser un message