22-Layer Server-Grade PCB Manufacturer | Heavy Copper PCB with Controlled Depth Drilling | UGPCB Expert Solutions

Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, intelligence artificielle, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Cartes de circuits imprimés (PCB) is paramount. Leveraging deep technical expertise, UGPCB fournit un professionnel, customized, high-performance server PCB manufacturing and PCB (Assemblage de la carte de circuit imprimé) one-stop solutions.

1. Présentation du produit & Définition

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, mémoire, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, intégrité de puissance, and thermal performance.

The specifications you provide (Épaisseur du panneau: 2.8mm ±10%, 22 Calques, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, haute densité, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

2. Design Essentials & Key Technologies

The success of such advanced Conceptions de PCB hinges on mastering a range of cutting-edge technologies:

1. Stack-up & Contrôle de l'impédance: The complex 22-layer stack-up requires precise calculation to achieve strict contrôle d'impédance (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of Conception de PCB à grande vitesse.

2. Back Drilling: This critical process removes the unused copper stub from high-speed signal vias (par ex., for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Df) and stable dielectric constant (Ne sait pas) ensure signal purity and low latency. A high Glass Transition Temperature (Tg >170° C) guarantees material reliability under the prolonged high-temperature operation of servers.

4. RTF (Reverse Treated Foil) Cuivre: Its smoother surface profile effectively reduces “effet peau” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (par ex., high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Performance & Caractéristiques structurelles

• Exceptional Electrical Performance: Extremely low signal loss and excellent impedance consistency meet the demands of high-speed protocols like PCIe 4.0/5.0 and DDR4/DDR5.

• Ultra-High Reliability: ACCEPTER (Or par immersion au nickel autocatalytique) surface finish provides a flat soldering surface and superior oxidation resistance, ensuring long-term connection reliability. The 10oz thick inner copper cores (combined with the 2/1oz design) offer robust current-carrying capacity and thermal pathways for power layers.

• Precision Manufacturing Capability: Le 0.1/0.1 mm trace/space and a minimum finished hole diameter of 0.25mm demonstrate UGPCB’s top-tier expertise in high-precision Fabrication de circuits imprimés.

• Robust Thermal Management: The 2.8mm thick board structure, combined with thick copper design, provides excellent thermal dissipation, aiding overall system cooling.

4. Processus de production & Contrôle de qualité

UGPCB’s server Production de PCB follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (ACCEPTER) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, Zone d'intérêt (Inspection optique automatisée), et plus, ensuring every delivered PCB meets design specifications.

5. Scénarios d'application & Technical Classification

This high-performance server PCB is widely used in:

• Serveurs d'IA & GPU Accelerator Cards: For processing massive parallel computing tasks.

• Cloud Computing Data Center Servers: As core compute nodes.

• High-End Storage Servers: For high-speed data storage and exchange.

• Network Switching Equipment: Core routing and switching motherboards.

Scientific Classification:

• Par nombre de couches: High Multi-layer Board (22 Calques)

• By Technology: High-Speed/High-Frequency PCB, Back-Drilled PCB, PCB en cuivre lourd, Interconnexion à haute densité (IDH) PCB

• Par candidature: Data Center/Server-Dedicated PCB