2-Carte PCB de couche FR-4 | 1.6mm d'épaisseur, HASL sans plomb | Prototype & Production – UGPCB

High-Performance FR-4 Double-Sided PCB Présentation du produit & Définition

Ce 2-Layer Rigid Circuit imprimé (PCB) from UGPCB is a fundamental and widely used electronic interconnect solution. It features a standard 1.6mm board thickness, dimensions of 224.02mm x 189mm, and utilizes high-grade KB FR-4 laminate. This double-sided PCB serves as the essential “backbone” for electronic designs, providing reliable electrical connections and mechanical support for components. It is an ideal, cost-effective choice for a vast range of industrial control, électronique grand public, and power supply applications.

Critical Design Considerations

Successful design of a double-sided PCB requires balancing electrical performance with manufacturability. Key considerations include:

• Routing Strategy: Efficiently utilize both top and bottom layers for trace routing. Plated Through-Holes (PTHs or Vias) enable inter-layer connections. Careful planning of trace density is crucial to prevent signal integrity issues like crosstalk.

• Hole & Pad Design: Specify appropriate drill sizes and pad diameters for all PCB vias and component leads to ensure mechanical strength and soldering reliability, adhérer à Normes IPC for annular ring.

• Pouvoir & Plans au sol: While dedicated planes are absent, designers should widen power and ground traces or implement a gridded copper pour to reduce impedance and enhance stability—a key aspect of robust Conception de circuits imprimés.

• Vérification des règles de conception (RDC): Prior to fabrication, rigorously verify that all parameters (trace width/clearance, hole sizes) align with the manufacturer’s capabilities (as per this board’s specs) to guarantee PCB design for manufacturability (DFM).

Principe de fonctionnement & Structure

The functionality of this double-layer circuit board stems from its layered structure:

1. Construction: The core consists of an FR-4 insulating dielectric layer, clad with copper foil (typiquement 1 once) on both sides. The unwanted copper is etched away during Fabrication de circuits imprimés, forming the desired circuit traces.

2. Electrical Interconnection: Circuits on the two layers are connected vertically via Plated Through-Holes (PTHs), created through mechanical drilling followed by electroless and electrolytic copper deposition.

3. Surface Protection: Le Lead-Free Hot Air Solder Leveling (HASL) finish applied to exposed copper pads prevents oxidation and ensures excellent solderability for component assembly.

Product Classification & Matériels

Per the provided specifications, this product is accurately classified as follows:

• Par nombre de couches: Double-Sided PCB ou 2-PCB de couche.

• By Substrate Rigidity: PCB rigide.

• Par matériau de base: Carte FR-4. Spécifiquement, FR-4 from the “Ko” brand, an epoxy glass laminate known for superior electrical insulation, résistance mécanique, et le retard de la flamme (UL94-V0).

• By Surface Finish: Lead-Free HASL PCB.

• By Application Complexity: Standard, General-Purpose Industrial-Grade PCB.

Performance & Caractéristiques clés

Leveraging the specified materials and processes, this PCB delivers the following core performance benefits:

• Reliable Mechanical & Performance électrique: Le KB FR-4 material offers stable dielectric constant and low dissipation factor for signal integrity. The 1.6mm standard thickness provides excellent resistance to bending and vibration.

• Dependable Interconnections: Le Lead-Free HASL surface finish provides a flat, highly solderable coating compatible with both wave soldering and hand soldering processes.

• Superior Thermal Stability: FR-4 substrate withstands standard soldering temperatures and offers a high continuous operating temperature, suitable for most électronique industrielle environnements.

• High Cost-Effectiveness: Compared to multi-layer boards, PCB double face offer significantly lower PCB fabrication cost and shorter lead times, representing an economical hardware solution.

• Environmental Compliance: Le HASL sans plomb process complies with international directives such as RoHS.

Detailed Manufacturing Process

UGPCB adheres to a stringent, high-standard PCB manufacturing process:

1. Ingénierie & CAM: Gerber file analysis, DFM check, and photoplot generation.

2. Panelization: Cutting the large FR-4 stratifié cuivré into production panels.

3. Forage: CNC drilling of component holes and PCB vias.

4. Hole Metallization: Désenduire, chemical copper deposition, and electrolytic copper plating to form conductive Plated Through-Holes (PTHs).

5. Patterning: Application de photorésist, exposition, development to transfer the circuit image.

6. Gravure: Removing unwanted copper to form precise circuit traces.

7. Masque de soudure & Écran à soigneux: Applying LPI solder mask (typically green) and legend printing.

8. Finition de surface: Applying HASL sans plomb coating to exposed pads.

9. Routing & Tests électriques: Profiling to final board outline and performing Electrical Test (Sonde volante or Fixture Test).

10. Inspection finale & Conditionnement: Comprehensive Inspection optique automatisée (Zone d'intérêt), dimensional verification, and vacuum-sealed, moisture-proof packaging.

Applications principales & Cas d'utilisation

This specification of double-sided FR-4 PCB is widely deployed in reliable and cost-sensitive applications:

• Industrial Control Systems: PLC controllers, motor drive boards, sensor interface modules.

• Power Supply Units: Switch-mode power supplies (SMPS), UPS systems, LED driver boards.

• Electronique grand public: Appliance control boards (AC, machines à laver), smart home controllers, équipement audio.

• Électronique automobile: Body control modules (BCM), lighting controllers, non-critical infotainment systems.

• Telecommunications Equipment: Functional modules within routers, commutateurs.

• Test & Measurement Instruments: Data acquisition and display panels for equipment.

Why Choose UGPCB for Your Double-Sided PCB Needs?

Partnering with UGPCB guarantees:

• Precision Manufacturing: Strict adherence to 1.6mm thickness, 224.02x189mm dimensions, et Matériau FR-4 specifications.

• Process Excellence: Standardized Lead-Free HASL PCB production ensures batch-to-batch consistency and reliability.

• Expert Technical Support: Our team provides comprehensive support, depuis Conception de circuits imprimés revoir to production consultation.

• Fast Turnkey Delivery: We offer competitive lead times for standard double-layer PCB prototypes and production runs.

Ready to start your project? Contact UGPCB today for a competitive quote and expert support. Let us be your trusted Fabricant de PCB and partner for success.