1. Présentation du produit: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (Circuit imprimé) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. Le PCB mesures 82.63 × 46.7 mm with a standard 1.6 mm épaisseur du panneau. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 millions d'unités dans 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. Définition du produit et spécifications techniques
2.1 Paramètres de base
| Paramètre | Spécification |
|---|---|
| Nom du produit | PCB de la carte mère de la hotte aspirante |
| Laminate Material | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| Épaisseur du panneau | 1.6 mm |
| Nombre de couches | 2 Calques (Double‑Sided Board) |
| Taille finie | 82.63 × 46.7 mm |
| Diamètre minimum du trou | 0.296 mm |
| Largeur de ligne minimale / Espacement des lignes | 0.342 mm / 0.37 mm |
| Épaisseur de la feuille de cuivre | 1/1 once (35 μm per layer) |
| Finition de surface | Nickel chimique / Immersion Or (ACCEPTER / Gold Plating Process) |
| Masque de soudure / Légende | Black Solder Mask / Légende de la sérigraphie blanche |
2.2 Laminate Material: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- Température de transition du verre (Tg) : 150° C (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- Index de suivi comparatif (CTI) : 600 V. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 V), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (CTE) : Alpha 1 à 41 ppm/°C, Alpha 2 à 235 ppm/°C.
- T288 Delamination Time : > 60 minutes, several times higher than standard FR‑4 materials.
- Température de décomposition thermique (Td, 5% perte de poids) : 370° C.
- Cote d'inflammabilité : UL94 V‑0.
- Résistivité de surface : 5.2 × 10⁸ MΩ.
- Résistivité du volume : 6.1 × 10⁹ MΩ‑cm.
- Résistance à l'écoulement : 1.4 N/mm (pour 1 feuille de cuivre d'une once).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, Norme générique sur la conception des cartes imprimées (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 mm. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
Je = k × ΔT ^ 0,44 × A ^ 0,725
Où:
- je = Maximum allowable current (Amperes, UN)
- k = Correction factor (0.048 for outer layer traces, 0.024 for inner layer traces)
- ΔT = Temperature rise (° C)
- UN = Conductor cross‑sectional area (mil²)
For this product with 1 feuille de cuivre d'une once (environ 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. Le 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 UN), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 Principes de fonctionnement
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, etc.) travel via touch traces on the PCB to the MCU. Après traitement, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, Lumières LED, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. Classement du produit
Based on printed circuit board industry classification standards, ce produit appartient aux catégories suivantes:
| Dimension de classification | Catégorie |
|---|---|
| Par structure | Rigid Printed Circuit Board |
| Par nombre de couches | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| Par finition de surface | Nickel chimique / Immersion Or (ACCEPTER) |
| Par candidature | Home Appliance Control Board (Cooker Hood Mother Board) |
| Par indice d'inflammabilité | UL94 V‑0 |
| By Environmental Compliance | Halogen‑Free, Rohs conforme |
ParIPC‑6012F, Qualification et spécifications de performances pour les cartes imprimées rigides (released September 2023), this product meetsClasse 2 – Dedicated Service Electronic Products exigences. Classe 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. Matériaux utilisés
5.1 Substrat: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- Renforcement : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (Tg 150°C)
- Feuille de cuivre : 1 oz Electrolytic Copper Foil (Cuivre ED)
- Système ignifuge : Halogen‑free flame retardant (UL94 V‑0)
5.2 Finition de surface: Nickel chimique / Immersion Or (ACCEPTER)
This product uses the Electroless Nickel / Immersion Or (ACCEPTER) surface finish process. ParIPC‑4552B, Specification for Electroless Nickel/Immersion Gold (ACCEPTER) Placage pour cartes imprimées (published May 2021), ENIG deposit thickness requirements are:
- Nickel Layer Thickness : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- Excellente soudabilité, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Superior oxidation and corrosion resistance
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 Masque de soudure et légende
- Masque de soudure : Black ink offering excellent insulation and heat resistance
- Légende : White silkscreen providing high contrast for SMT placement and repair identification
6. Product Structure and Performance Characteristics
6.1 Caractéristiques structurelles
Double‑Sided Design (2 Calques) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Minimum hole diameter of 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : Le 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
Standard 1.6 mm Épaisseur du panneau : This thickness maintains mechanical strength while matching standard component lead lengths, faciliter PCB assemblée.
6.2 Caractéristiques de performance
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (peak 260°C).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (FAC) formation, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. Flux de processus de fabrication
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
Étape 1: Contrôle de la qualité entrant (Iqc) → Inspect KB6165G copper‑clad laminate, feuille de cuivre, film sec, encre de masque de soudure, and other raw materials
Étape 2: Coupe → Cut large copper‑clad laminate sheets to working panel size
Étape 3: Forage → CNC drilling machines process the 0.296 mm minimum hole diameter along with other mounting holes and vias
Étape 4: Dépôt autocatalytique de cuivre / Placage de panneaux → Metallize hole walls to create conductive through‑holes
Étape 5: Transfert de motif → Apply dry film → Expose → Develop to form the circuit pattern
Étape 6: Gravure → Remove unprotected copper to create the designed circuit traces
Étape 7: Masque de soudure → Print black solder mask ink → Expose → Develop to expose pads
Étape 8: ACCEPTER (Nickel chimique / Immersion Or) → Electroless nickel plating (3‑6 μm) + L'or d'immersion (0.05‑0.10 μm)
Étape 9: Impression de légende → Print white silkscreen legend identifiers
Étape 10: Routage / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 mm
Étape 11: Tests électriques → Test de sonde volante / fixture testing to verify open/short circuit integrity
Étape 12: Contrôle de la qualité final (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 normes
Étape 13: Emballage et expédition → Vacuum packaging + anti‑static bags, compliant with IPC packaging specifications
8. Application Scenarios and Market Applications
8.1 Scénarios d'application principaux
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 Perspectives du marché
China’s small appliance control board market is projected to reach approximately RMB 45 milliards dans 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% à 90% Rh (significant steam generated during cooking)
- Degré de pollution : Pollution Degree 2‑3 (fume and dust)
- Vibration : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅International Standard Compliance : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, fabrication, et inspection
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, CTI 600 V, and UL94 V‑0 rating
✅Precision Manufacturing Capability : Minimum hole diameter of 0.296 mm et une largeur de trait minimale de 0.342 mm
✅Finition de surface supérieure : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅Conformité environnementale : Halogen‑free materials meeting RoHS and REACH directives
✅Customization Services : Flexible customization of dimensions, nombre de couches, matériau stratifié, et finition de surface
✅Livraison rapide : Quick‑turn capability from prototypes to volume production
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UGPCB is committed to providing high‑quality cooker hood motherboard Fabrication de PCB services to customers worldwide. Whether you need prototype samples or volume production, nous offrons un support technique professionnel et des prix compétitifs.
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📧 E-mail: sales@ugpcb.com
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💡 Please provide the following information for an accurate quote:
- PCB dimensions, nombre de couches, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (prototype / petit lot / production en volume)
- Fichiers Gerber (si disponible)
Send your requirements today, et le UGPCB professional team will respond with a detailed quote and technical recommendations within 24 heures!
Déclaration de source de données
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : Qualification et spécifications de performances pour les cartes imprimées rigides, Septembre 2023, IPC International, Inc.
- IPC‑2221C : Norme générique sur la conception des cartes imprimées, Août 18, 2025, IPC International, Inc.
- IPC‑4552B : Specification for Electroless Nickel/Immersion Gold (ACCEPTER) Placage pour cartes imprimées, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : Kingboard Laminés Holdings Ltd. official product technical documentation
- UL94 : Norme pour les tests d'inflammabilité des matériaux plastiques pour les pièces d'appareils et d'appareils, Underwriters Laboratories Inc.
- IPC‑TM‑650 : Manuel des méthodes d'essai, IPC International, Inc.
