6 Layer Rigid-Flex PCB Manufacturing | High-Reliability Adhesive-Free Design – UGPCB

UGPCB 6-Layer Adhesive-Free Rigid-Flex PCB Présentation du produit & Définition

A 6-Layer Rigid-Flex PCB is an advanced circuit imprimé technology that integrally combines rigid board stability with flexible circuit dynamic bending capability. This product from UGPCB utilizes a premium adhesive-free lamination processus, resulting in a final board thickness of 1.50mm, dimensions of 120x80mm, and features an ACCEPTER (Or par immersion au nickel autocatalytique, 3m”) finition de surface. It represents a cutting-edge solution for Interconnexion à haute densité (IDH) and three-dimensional electronic packaging, solving complex spatial and mechanical challenges in modern electronics.

Scientific Product Classification

According to IPC-6013D standards and product construction, this board is accurately classified as:

• By Construction: Rigid-Flex Printed Board (Taper 4)

• Par nombre de couches: Six-Layer Board (combining rigid and flexible layers)

• By Technology: Adhesive-less (Adhesive-Free) Flexible Material Rigid-Flex PCB

• Par candidature: High-Reliability, High-Flex-Cycle Industrial & Medical Grade PCB

Core Structure & Matériels

The exceptional performance is rooted in its sophisticated layered structure and top-tier materials:

• Core Flex Material: Caractéristiques Shengyi’s 18/50/18 μm adhesive-free double-sided substrate. “18/50/18” denotes a structure of 1 once (18µm) cuivre / 50μm Polyimide (PI) dielectric / 1 once (18µm) cuivre. Le adhesive-free construction bonds copper to PI chemically, eliminating adhesive layers, which significantly enhances thermal resistance, chemical resistance, et flex circuit fiabilité.

• Rigid Section Material: Uses 25/25 préampe for lamination in rigid areas, providing robust mechanical support.

• Finition de surface: The entire board employs ACCEPTER (3m”). This 3-microinch gold layer offers excellent flatness, oxidation resistance, and solderability for PCB pads, making it ideal for assembling fine-pitch components like BGAs.

Design Key Considerations & Principe de fonctionnement

Rigid-flex PCB design is critical for success. The board operates by routing electrical signals through flexible polyimide areas for dynamic movement, while using rigid FR-4 sections for component mounting and structural support.

Essential Design Guidelines Include:

1. Bend Area Definition: Clearly distinguish between static (one-time install) et dynamic (repeated operation) bend zones. Design the bend radius accordingly. A dynamic bend radius should be at least 10x the flex area thickness (for this board, ≥15mm is recommended).

2. Transition Zone Reinforcement: The rigid-to-flex junction is a stress point. Utiliser teardrop pads, curved traces, et stiffeners to prevent delamination and cracking.

3. Contrôle de l'impédance: For high-speed signals (par ex., differential pairs) crossing flex areas, precisely calculate trace width and dielectric thickness to maintain consistent impédance caractéristique (par ex., 50Ω single-ended, 100Ω differential).

4. Flex Routing Rules: In flexible areas, route conductors perpendicular to the bend axis. Use curved or staggered traces to distribute stress evenly.

Caractéristiques de performance & Avantages

Compared to traditional adhesive-based rigid-flex PCBs or rigid-board+connector assemblies, this UGPCB product offers distinct PCB advantages:

• Fiabilité accrue: The adhesive-free structure prevents delamination risks from adhesive aging or moisture absorption, increasing flex life by up to 10x and withstands over 100,000 dynamic bend cycles.

• Superior Electrical Performance: Uniform PI dielectric with stable dielectric constant (Dk~3.4) ensures signal integrity for high-frequency applications and reduces loss.

• Léger & À haute densité: Eliminates connectors, câbles, and solder joints, enabling 3D assembly. Can reduce system weight by up to 60% and save over 50% espace.

• Excellent Durability: Resists extreme temperatures (-55°C to +125°C) and chemical exposure, suitable for harsh environments.

• Simplified Assembly: A single integrated component reduces assembly steps, potential failure points, and improves final product yield.

Production Process Overview

UGPCB rigid-flex PCB manufacturing combines advanced rigid PCB fabrication et flexible circuit production processus:

1. Inner Layer Fabrication: Separate etching of rigid FR-4 and flexible PI core layers.

2. Laminage: Precise alignment and high-temperature/pressure bonding of rigid layers, adhesive-free flex cores, and prepreg into a monolithic structure—a critical step in carte PCB multicouche traitement.

3. Forage & Placage: Mechanical and laser drilling (if needed) followed by copper deposition and plating to create Trous traversants plaqués (PTH) for interlayer connection.

4. Outer Layer Imaging & Gravure: Pattern formation for outer layer circuits.

5. Application de finition de surface: ENIG chemical deposition.

6. Coverlay & Profiling: Application of protective film (coverlay) on flex areas. Precise routage et laser cutting define the board outline and flex section openings.

7. Test électrique & Inspection finale: 100% sonde volante or fixture testing for electrical continuity, followed by rigorous visual and dimensional inspection.

Applications principales & Cas d'utilisation

Ce 6-layer high-reliability PCB is the ideal choice for demanding applications:

• Aérospatial & Défense: Satellite deployment mechanisms, guidance systems, avionics sensors requiring utmost reliability and weight reduction.

• Advanced Medical Devices: Endoscopes, ultrasound probes, wearable monitors needing complex motion and signal transmission in minimal space.

• Industrial Robotics: Robot joints, internal robotic arm assemblies for seamless power/signal transmission across moving parts.

• Precision Instruments & Electronique grand public: Advanced camera modules, foldable display hinges, drone gimbals pursuing slimness and durability.

• Électronique automobile: Automated parking sensors, foldable dash displays, in-vehicle camera modules resistant to vibration and thermal cycling.

Ready to integrate superior reliability into your design? Contact UGPCB engineers today for a free design review and quote on your custom 6-Layer Rigid-Flex PCB solution.