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Einseitige Flex-Leiterplatte mit Al-Versteifung | 0.2mm Ultradünn | UGPCB - UGPCB

Starr-Flex-Leiterplatte/

Einseitige Flex-Leiterplatte mit Al-Versteifung | 0.2mm Ultradünn | UGPCB

Schichtzahl: 1-Layer Flex PCB with Aluminum Stiffener

Brettdicke: 0.2 ± 0.08 mm

Substrate Material: Shengyi Single-sided Adhesive-backed Laminate (70 μm Cu / 25 μm PI)

Oberflächenbeschaffung: Bio -Lötlichkeitsschutz (OSP)

Board Dimension: 240 × 165/3 mm

  • Produktdetails

Ultra-Thin Single-Sided Flex PCB with Aluminum Stiffener Produktübersicht & Definition

In the pursuit of thinner, lighter, and more reliable electronic devices, UGPCB Ultra-Thin Single-Sided Flex Leiterplatte with Aluminum Stiffener represents the optimal fusion of flexible circuit technology and structural reinforcement. This solution is engineered to meet the critical challenge of requiring both dynamic flexibility and localized rigidity, Verbesserte Wärmeabteilung, and superior dimensional stability within constrained spaces.

This product is scientifically classified as a: Single-Sided, Adhesive-Based Flexible Printed Circuit (FPC) with a Localized Aluminum Stiffener. It features a standard single-sided FPC construction with a precisely bonded aluminum alloy stiffener in specific zones, creating a cost-effectiverigid-flex-likeperformance where it matters most.

 UGPCB reinforced flexible PCB surface

Schlüsselspezifikationen

  • Schichtzahl: 1 Schicht (Single-Sided Conductor)

  • Gesamtdicke: 0.2mm ±0.08mm (Including base material, Kupfer, and stiffener)

  • Grundmaterial: Shengyi S1145 or equivalent 1oz (70µm) Kupfer / 25µm Polyimide (PI) Single-Sided, Adhesive-Based Flex Laminate

  • Stiffener Material: Aluminum Alloy (z.B., 5052 oder 1060)

  • Oberflächenbeschaffung: OSP (Bio -Lötlichkeitsschutz)

  • Board Dimensions: 240mm x 165mm (Customizable per design)

Design-Grundlagen & Structure Analysis

Successful aluminum stiffener FPC design begins with precise application analysis. Design engineers must define:

  1. Stiffener Placement: Accurately identify areas for connector mounting, Komponentenplatzierung, or mechanical fastening.

  2. Dynamic Flex Zone Planning: Ensure bending occurs only in designated flexible areas, avoiding the stiffener to maximize flex life.

  3. Thermal Management Path: Utilize the aluminum’s high thermal conductivity by connecting copper pads under heat-generating Komponenten (z.B., LEDs, ICs) directly to the stiffener, creating an efficient heat-spreading pathway.

  4. Toleranz & Registration: Strictly control the alignment tolerance between the stiffener and the FPC to ensure accurate mounting hole placement.

Wie es funktioniert & Performance Advantages

Der PCB with aluminum stiffener operates on a simple yet effective principle:

  • In Flexible Areas: The thin PI and copper construction provides excellent dynamic flexing and space-saving capabilities.

  • In Stiffened Areas: The aluminum plate offers rigid PCB-like mechanical support, preventing tearing during connector mating or screw fastening, while rapidly dissipating localized heat.

Core Features & Vorteile:

  • Exceptional Thinness: ~0.2mm profile ideal for ultra-slim devices.

  • Targeted Rigidity-Flexibility: Solves thewhere to be rigid, where to be flexibledilemma in a single, cost-effective package.

  • Enhanced Thermal Performance: The aluminum stiffener acts as an integrated heat spreader, improving component reliability.

  • Superior Dimensional Stability: The stiffened area resists warping under thermal and mechanical stress, ensuring precise assembly.

  • Hohe Zuverlässigkeit & Haltbarkeit: Protects solder joints and vias in critical areas from stress and fatigue.

  • OSP-Oberflächenfinish: Provides excellent solderability and a flat surface for reliable SMT assembly.

Aluminum alloy stiffener, UGPCB reinforced flexible PCB surface

Herstellungsprozess & Qualitätskontrolle

UGPCB employs a mature flex circuit stiffener attachment process ensuring precision and reliability:

  1. FPC Fabrication: Processing of adhesive-based laminate (z.B., Shengyi) through patterning, Radierung, and drilling.

  2. Oberflächenbearbeitung: Application of OSP coating to exposed copper pads.

  3. Präzisionslaminierung: Bonding of the pre-cut aluminum stiffener to the FPC using controlled heat and pressure with adhesive (pre-preg or base material adhesive layer).

  4. Contour Routing & Profilierung: Final board outline, stiffener shape, and mounting holes are created via CNC or laser cutting.

  5. Umfassende Tests: Includes electrical testing (Flying Probe/Fixture), dimensional AOI, and peel strength tests for the stiffener bond.

Primäranwendungen & Anwendungsfälle

Das ultra-thin flex PCB with metal stiffener is ideal for:

  • Unterhaltungselektronik: Side-key flex cables, camera module FPCs, display connectors in smartphones/tablets.

  • LED-Beleuchtung: Ultra-thin LED strips and flexible neon signs, where the stiffener aids in heat sinking and mechanical fixing.

  • Kfz -Elektronik: Sensor wiring harnesses, dashboard backlight units requiring vibration resistance.

  • Industrieausrüstung: Connections for precision probes, internal wiring in robotic arms needing localized reinforcement.

  • Medizinprodukte: Internal interconnects for portable medical equipment demanding lightweight reliability.

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