4-Hersteller von starr-flexiblen Leiterplatten – Hoher Tg, 1.6mm dick, ENIG+Vergoldung | UGPCB

1.UGPCB 4-Layer High Tg Rigid-Flex PCB Produktübersicht: Redefining High-Reliability Interconnectivity

In modern high-end electronic design, traditional rigid Leiterplatten (Leiterplatten) are often limited by space and form factor, while Flexible PCBs (FPCs) may lack mechanical support. Starr-Flex-Leiterplatte Technologie, an innovative Leiterplattenherstellung Lösung, perfectly merges the stability of rigid boards with the bendability of flexible circuits. UGPCB 4-Layer High Tg Rigid-Flex PCB, with its precise lamination structure, superior material selection, and demanding surface finish, stands as the ideal PCB solution for complex 3D spatial layouts and harsh operating environments.

2. Scientific Classification & Core Parameters

• Scientific Classification: Pro IPC -Standards and industry norms, this product is accurately classified as a 4-Layer High Thermal Reliability Rigid-Flex Printed Circuit Board.

• Core Parameters:

  • Layer Construction: 4 Schichten (4L Starr-Flex-Leiterplatte)

  • Brettdicke: 1.60mm (in rigid areas, including dielectrics and copper)

  • Grundmaterial: Panasonic RF-777 (35/50µm copper)

  • Oberflächenbeschaffung: ZUSTIMMEN (Elektrololes Nickel -Eintauchgold) 3µ” + Selective Electroplated Hard Gold 30µ”

  • Abmessungen: 126mm * 80mm

3. Design-Grundlagen & Structure Analysis

Successful Rigid-Flex PCB design ist kritisch. This product is designed adhering to these key points:

1. Rigid-to-Flex Transition Zone Design: Bend areas are meticulously simulated, avoiding right and acute angles. Smooth curved traces are implemented to eliminate stress concentration points, a cornerstone of high-reliability PCB design.

2. Stack-up Symmetry: Rigid sections employ a symmetrical lamination stack-up (z.B., copper-dielectric-core-dielectric-copper) to prevent warping under thermal stress.

3. Materialkompatibilität: The selected Panasonic RF-777 material has matched Coefficients of Thermal Expansion (CTE) in both rigid and flexible zones, ensuring robust bonding at the interfaces.

Structural Feature: The board is constructed by laminating two rigid outer sections with a multilayer structure containing flexible inner layers, enabling electrical interconnection in three-dimensional space.

Image Suggestion 2: A detailed cross-sectional diagram of the board’s layer stack-up, clearly labeling rigid areas, flex areas, Materialien, und Dicken.
Alt Tag: Cross-section diagram of a 4-Layer Rigid-Flex PCB stack-up, showing the integration of rigid FR-4 and flexible polyimide materials.

4. Materialien & Leistung

• Kernmaterial: Panasonic RF-777. This is a high-performance laminate specifically optimized for Rigid-Flex PCB fabrication.

  • High Glass Transition Temperature (Tg): Provides excellent thermal stability, maintaining mechanical and electrical properties during high-temperature soldering (z.B., lead-free reflow) and in high-temperature operating environments.

  • Niedriger DK (Dielektrizitätskonstante) & Df (Dissipationsfaktor): Ensures signal integrity for Hochfrequenz-Leiterplatte Anwendungen.

  • Superior Dimensional Stability & Chemischer Widerstand: Guarantees long-term reliability.

• Oberflächenbeschaffung: ENIG 3µ” + Electroplated Hard Gold 30µ”. This combination is a key differentiator.

  • ZUSTIMMEN: Provides a flat, highly solderable surface finish across the entire board, suitable for fine-pitch component assembly.

  • Electroplated Hard Gold: Applied selectively to connector fingers or areas subject to frequent insertion/withdrawal or friction, the 30µ” hard gold layer dramatically increases wear resistance, Oxidationsbeständigkeit, und Kontaktsicherheit, extending connector lifecycle.

5. Manufacturing Process Flow

UGPCB employs industry-leading PCB production processes to ensure quality:

1. Laser & Mechanical Drilling: High-precision drilling for varying hole size requirements.

2. Hole Metallization & Überzug: Ensures interlayer connectivity.

3. Patterning & Radierung: Forms precise circuit patterns.

4. Laminierung & Pressing: Precisely bonds rigid and flexible layers into a single unit under high heat and pressure—the technical core of rigid-flex circuit board processing.

5. Oberflächenbearbeitung: Sequential application of ENIG and selective hard gold plating.

6. Contour Routing & Testen: Final outline achieved via CNC and laser routing, followed by AOI (Automatisierte optische Inspektion), electrical testing, and flex-cycle reliability testing.

Image Suggestion 3: An image of a modern PCB production line, focusing on a lamination press or AOI inspection station.
Alt Tag: UGPCB’s modern Rigid-Flex PCB production line featuring high-precision lamination and inspection equipment for quality assurance.

6. Schlüsselvorteile & Produktmerkmale

• 3D Design Freedom: Solves complex spatial layout challenges, reduces connectors and cabling, and enhances system reliability.

• Exceptional Mechanical & Elektrische Leistung: High-strength flex joints withstand thousands of dynamic bend cycles; shortened signal paths reduce loss.

• High Reliability Assurance: High Tg material and dual surface finish ensure stable long-term operation in harsh environments (hohe Temperatur, humidity, vibration).

• Weight & Size Reduction: Contributes to overall device miniaturization and lightweight design.

7. Typische Anwendungen

Das 4-Layer Rigid-Flex PCB is the preferred PCB component for demanding sectors:

• Industriell & Kfz -Elektronik: Vibration-resistant connections in control systems, automotive sensors, and Engine Control Units (ABDECKUNG).

• Medizinprodukte: Endoskope, portable monitors, hearing aids—devices requiring precise, zuverlässig, and bendable interconnects.

• Luft- und Raumfahrt & Verteidigung: Avionics and military electronics where weight, space, and reliability are paramount.

• High-End-Verbraucherelektronik: Camera module connections in smartphones, hinge connections in wearables, advanced digital cameras.

8. Warum wählen Sie UGPCB??

As a professional Leiterplattenhersteller, UGPCB ist spezialisiert auf Starr-Flex-Leiterplatte Technologie, offering full-spectrum capabilities from PCB design support und Präzision Leiterplattenfertigung to rigorous PCB-Tests. We commit to:

• Expert Engineering Support: Free PCB design for manufacturing consultation for your project.

• Consistent, Reliable Quality: Every board undergoes stringent reliability testing.

• Competitive Pricing & Lead Times: Optimized supply chain and production management deliver high-value PCB solutions.

Contact UGPCB today for a free prototype evaluation and quote. Let our professional Leiterplattenherstellung services power your innovative product to market success.